Suzhou Dongshan Precision Manufacturing Co., Ltd.

Semi-Annual Report 2026

August 22, 2026

Section I Important Note, Table of Contents and Definitions

The Board of Directors, directors, and senior executives of the Company hereby warrant that the information contained in this Semi-Annual Report is true, accurate and complete without any misrepresentation, misleading statement or material omission, and agree to assume joint and several liabilities for this Semi-Annual Report.

YUAN Yonggang, Chairman of the Company, CFO WANG Xu and Accounting Supervisor ZHU Deguang hereby represent that the financial report contained in this Semi-Annual Report is true, accurate and complete.

All directors of the Company attended the meeting of the Board of Directors reviewing this Semi-Annual Report.

Forward-looking statements such as those on future development plans in this Report do not constitute substantial commitments by the Company to the investors. Investors and relevant persons shall be sufficiently mindful of risks, and understand the differences between plans, predictions and commitments.

In this Report, the Company has elaborated relevant potential risk factors and countermeasures, as can be referred to in “X. Risk Exposures to the Company and Countermeasures” under “Section III Management’s Discussion and Analysis”, to which the investors should pay attention.

The Company has no plan to pay cash dividends, distribute bonus shares or convert any capital reserve to the share capital.

Note: This document is a translated version of the Chinese Semi-Annual Report 2026 (“2026 年半年度报告”). In case of any discrepancies, the Semi-Annual Report 2026 published in the Chinese version shall prevail. The full Chinese Semi-Annual Report 2026 is available at www.cninfo.com.cn.

Table of Contents

• Section I Important Note, Table of Contents and Definitions......................................................................2
• Section II Company Profile and Financial Highlights..................................................................................9
• Section III Management’s Discussion and Analysis....................................................................................12
• Section IV Corporate Governance, Environment, and Society..................................................................38
• Section V Significant Matters........................................................................................................................41
• Section VI Changes in Shares and Shareholders.........................................................................................51
• Section VII Bonds...........................................................................................................................................55
• Section VIII Financial Report.......................................................................................................................56

List of References

• I. Financial statements signed and chopped by Mr. YUAN Yonggang, legal representative, Mr. WANG Xu,

CFO, and Mr. ZHU Deguang, Accounting Supervisor of the Company;

• II. Originals of all documents of the Company publicly disclosed during the reporting period and related

announcements;

• III. Original of the Semi-Annual Report 2026 stamped with the seal and signed by the legal representative of the

Company; and

• IV. Place for keeping such documents for inspection: Securities Department of the Company at Building 12#,

Yunhe Town Headquarters Industrial Park, No. 99 East Taihu Road, Wuzhong District, Suzhou.

Definitions

Section II Company Profile and Financial Highlights

I. Company Profile

II. Contact Person and Contact Information

III. Other Information

1. Contact Information of the Company

Whether there is any change in the Company’s registered address, office address and corresponding postal code, website, and email address, etc. during the reporting period?

□ Applicable  N/A There has been no change in our registered address, office address and corresponding postal code, website and email address, etc. during the reporting period, as detailed in the Annual Report 2025.

2. Media for Information Disclosure and Place for Keeping Semi-Annual Report

Whether there is any change in the media for information disclosure and place for keeping the report during the reporting period?

□ Applicable  N/A The website of the stock exchange and the media and its website disclosing our semi-annual report, as well as the place for keeping our semi-annual report remain unchanged during the reporting period, as detailed in the Annual Report 2025.

3. Other Related Information

Whether there is any change in other related information during the reporting period?

□ Applicable  N/A

IV. Key Accounting Data and Financial Indicators

Did the Company need to retrospectively adjust or restate any accounting data of prior years?

□ Yes  No

V. Differences in Accounting Data under the Chinese Accounting Standards for Business Enterprises (the “CASBEs”) and Overseas Accounting Standards

• 1. Differences in net profit and net assets disclosed in the financial report prepared under the International Financial Reporting Standards (IFRS) and the CASBEs

□ Applicable  N/A There was no difference in net profit and net assets disclosed in the financial report for the reporting period prepared under the IFRS and the CASBEs.

• 2. Differences in net profit and net assets disclosed in the financial report prepared under overseas accounting standards and the CASBEs

□ Applicable  N/A There was no difference in net profit and net assets disclosed in the financial report for the reporting period prepared under overseas accounting standards and the CASBEs.

VI. Items and Amounts of Non-recurring Gains or Losses

 Applicable □ N/A

In RMB

Other items of gain or loss within the meaning of non-recurring gain or loss:

• □ Applicable  N/A We do not have any other item of gain or loss within the meaning of non-recurring gains or losses.

Classification of any item of non-recurring gain or loss defined by the Explanatory Announcement No. 1 on Information Disclosure by Companies Publicly Offering Securities – Non-recurring Gain or Loss as recurring gain or loss:

• □ Applicable  N/A

We have not classified any item of non-recurring gain or loss defined by the Explanatory Announcement No. 1 on Information Disclosure by Companies Publicly Offering Securities – Non-recurring Gain or Loss as recurring gain or loss.

Section III Management’s Discussion and Analysis

I. Situations of Our Primary Business during the Reporting Period

(I) During the reporting period, our primary business has not undergone any material change. We are an innovation-driven company focusing on the field of intelligent manufacturing with a global perspective and layout. Under the mission of “building a better connected world for tomorrow” and the vision of becoming a globally leading solution provider for intelligent interconnection, we are dedicated to providing advanced products and solutions to global leading technology companies for interconnection among human beings, equipment, and infrastructure. Our main business covers the global design, production, and sale of electronic circuits, optical transceivers (including optical chips), precision components, and photoelectric display modules; our products are widely applied in the fields of consumer electronics, vehicles, data centers, communication equipment, industrial control equipment, etc. By providing all-round and one-stop comprehensive services and constantly enhancing customer loyalty for cooperation, we have established long-term stable strategic cooperation relationships with global leading enterprises.

Our main products and their applications:

(II) During the reporting period, our main business model has not undergone any material change. We manufacture main products based on market demands, and adopt the production mode that determines production according to sales, under which we develop production plans and deliver products by taking into account the purchase orders placed by customers, the product quantities demanded by the customers, as well as our production capacity and supply of raw materials.

• 1. Purchase mode Our main businesses, covering electronic circuits, optical transceivers (including optical chips), precision components, photoelectric display modules, etc., require a wide variety of raw materials. Based on the purchase scale, our main raw materials include integrated circuit chips, electronic components, connectors, display devices, copper clad laminates, cast parts, wafers, aluminum parts, etc. We make purchase from corresponding suppliers with reference to orders and production plans based on our information about the lead time and quality of suppliers. Given that our products are mostly customized, suppliers should be qualified by us or our customers, and we have to obtain the consent and certification from customers for new alternative suppliers. Generally, we request order-based prompt supply from suppliers instead of keeping a large number of surplus raw materials and parts; under certain circumstances, we may also require suppliers to establish a local warehouse to shorten the lead time of raw materials and reduce our inventory. We purchase a wide variety of raw materials in large quantities. Our Group Purchase Management Center is responsible for coordinating purchase activities, in which we promote green purchase and give full play to the advantages of large-volume purchase and synergy effects of raw materials. We have established long-lasting, stable, and mutually beneficial strategic cooperation relationships with core suppliers to ensure a stable supply chain and reduce purchase costs.
• 2. Production mode We manufacture products based on market demands, and adopt the production mode that determines production according to sales, under which we develop production plans and promptly deliver products to customers after passing inspection by taking into account the purchase orders placed by customers, the product quantities demanded by the customers under such purchase orders, as well as our production capacity and supply of raw materials. We implement the ideas of green development and low-carbon operation, and we always give priority to development coordinating a new generation of information technologies with manufacturing technologies, taking intelligent manufacturing as the main direction for the integration of informatization and industrialization and taking active measures to promote the construction of intelligent factories and digital workshops. On one

hand, we make great efforts for automatic production and construction to improve production efficiency; on the other hand, we implement information-based production operation and management to achieve real-time management and control over the whole production operation process, which increases the product yield rates, improves capacity utilization rate, ensures prompt delivery of orders, and guarantees the quality of products and services in compliance with normative standards and customer requirements.

• 3. Sales mode We sell directly to corporate customers. After we pass customers’ system certification and are admitted to their supplier system, customers will directly place orders to us. We implement the strategy of group-based coordinated sales and build dedicated key-account service teams for various business segments to promptly respond to requests from customers. Focusing on basic core devices in the field of intelligent interconnection, we have built a rich product matrix after years of development. Thanks to the suitability of our products for a variety of industries and the strong synergy effects we achieved for R&D, technology, supply chain, product, market, etc. in different business segments, the multi-product synergy advantages allow us to provide customers with allround, one-stop comprehensive product solutions with leading technologies to meet customization requests of customers to the largest extent.
• 4. R&D mode We have built an efficient R&D system focusing on independent R&D of core technologies and oriented to meeting the innovation needs of customers, and we keep close pace with the strategic layout of industry leading customers and actively participate in new product development by customers to support customers in product iteration and function innovation. Meanwhile, we strive to build platform-based R&D institutions and platform-based core technologies, pay close attention to the development dynamics of new technologies and new processes in the industry, and conduct continuous and effective R&D investment and study of cutting-edge technologies to maintain the leading position of the Company in technologies and processes and actively promote the implementation, update, and iteration of downstream terminal products of the industry. With importance attached to the education of technical talents, we provide the talent support for the development of new technologies and new products by measures of “talent education, talent attraction, and talent retention”, and take active measures to coordinate R&D resources and encourage cross-department joint development.

In addition to the transformation and upgrade of our own technologies in our R&D activities, we also pay attention to indepth cooperation with customers and the study of future industry trends. By properly combining flexibility, coordination, and innovation, we have built a R&D ecology system featuring sustainable development and high adaptability to meet the constantly changing customer needs and market environments, and promote coordinated innovation throughout the industry chain.

(III) Applications of our products, as shown in the figure below:

 Leather parts  White body parts

 HUDs

 Seat–Framework assemblies

 Dash boards and central control displays (irregular-shaped displays/multiconnected displays/curved displays)  Passenger and rear seat entertainment

displays

 Streaming electronic rearview mirrors

 Armrest displays

 Automotive electronics (EMS OEM: battery management/electric control/domain control/radars)

 On-board computer–heat dissipation modules (water-cooling boards)

 Electric drive and electronic control– casings (all-in-one)

 Central control system/GPS–rigid PCBs and rigid-flexible PCBs

 Domain control–casings

 Information & entertainment systems/Internet of Vehicles–rigid PCBs and rigid-flexible PCBs

 Camera modules–brackets and assemblies

 Camera modules–rigid PCBs and rigidflexible PCBs

 Cell–casings

 Battery pack–Trays/assemblies

 Battery pack–flexible PCBs/CCS

 Laser radars/millimeter wave radars– casings

 Laser radars/millimeter wave radars–rigid PCBs and rigid-flexible PCBs

 Advanced driving assistance/central computing unit - rigid PCBs

 Damper tower

 Injection molding parts

 Fingerprint flexible PCBs

 Flexible PCBs for front cameras

 LCD/OLED displays

 Flexible PCBs for upper antennas

 Flexible PCBs for displays

 Main board PCBs

 Flexible PCBs for lower antennas

 Flexible PCBs for side buttons

 Flexible PCBs for USBs

 Flexible PCBs for rear cameras

 Flexible PCBs for batteries

Computing nodes

 Cabinet sheet metal parts

 Rails

 Tray panels

 Handles/latches

 Power distribution boards

 Universal substrates

 Air dust brackets  Shielding covers

 Main boards

 Heat dissipation modules (liquid cooling)

 EMI masking metal parts

 Front panel metal parts

 Optical fiber jumpers

 Optical transceivers

 M.2 carrier boards

 Cable clamps

 Cable management metal parts

Switch nodes

 M.2 carrier boards

 Optical transceivers

 Switch main boards

 Dual in-line memory

 PSU control boards/metal casings

modules  Substrates

 Substrate management controller

 Optical transceivers

(IV) Situations of our industry We are primarily engaged in the R&D, manufacturing, and sale of electronic circuits, optical transceivers (including optical

chips), precision components, photoelectric display modules, etc.

1. Electronic circuit industry

Printed circuit boards (PCBs), as core basic components of electronic devices, play a critical role in accurate electric interconnection, low-loss signal transfer, and mechanical support, and its performance directly determines the operating efficiency and stability of electronic devices. In terms of the fields of application, PCBs are widely used in core scenarios like consumer electronics, vehicles, data centers, communication, etc., making PCBs an indispensable basic link for the electronic information industry.

Thanks to the explosive demands of AI and high-speed network infrastructure, the global PCB market experienced rapid growth. In the long run, driven by multiple factors, including AI infrastructure construction, restructuring of the global supply chain, terminal intelligentization, etc., the growth dynamics of the industry will be released for a long period of time. Prismark predicted that the global PCB market size would reach USD 95.8 billion by 2026; the annual compound growth rate of the industry value would be about 7% from 2026 to 2029, and may exceed USD 116.0 billion by 2029. From 2025 to 2030, the fastest-growing fields will still be HLC PCBs (over 18 layers), HDI PCBs, etc. The figures above show that AI-driven data communication infrastructure is becoming the core engine to drive the upgrade and size expansion of the PCB industry.

From the perspective of enterprise development, the structural transformation of the PCB industry is creating relatively certain development opportunities for us. On one hand, in the field of consumer electronics, the innovation for products like AI terminals, foldable screens, and other products leads to continuously increasing quantity of FPC in use and value of individual devices. Relying on the production capacity and technologies of MFLEX, a top 2 manufacturer on the world, we can provide a stable cash flow and profit support for conventional businesses. On the other hand, in the field of AI computing hardware, the growth center of the industry is transforming to HLC PCBs and HDI PCBs more and more quickly. Thanks to Multek’s professional manufacturing capabilities of ultra-HLC PCBs, together with the decisive investment of resources for expansion of high-end production capacity, we can properly take the historical development opportunities that the value of PCBs for AI servers is obviously greater than conventional products. The PCB industry is experiencing a fundamental change under the two major

trends of high-end consumer electronics and AI infrastructure, which opens a significant window for us to develop from a leading FPC manufacturer to a supplier of all high-end PCB products.

1. Optical transceiver industry

The optical transceiver technology, employing the mechanism of electrical - optical - electrical signal conversion, has developed generational advantages in terms of the bandwidth capacity, transfer distance, anti-interference performance, energy efficiency and density, etc. on the basis of the transfer characteristics of optical fiber, which systematically solves the core transmission challenge of large-traffic interaction and interconnection of wide area networks, making it a key technology supporting the upgrade of communication networks and empowering computing infrastructure. The continuously increasing downstream bandwidth demands lead to the gradual iteration and upgrade of optical chip rates to 100G, 200G, and more, which directly determines the transfer rate and application scenario positioning of optical transceivers.

On the background of the continuously increasing global investment in computing power, AI has become the core growth engine for the market of optical transceiver data communication. Lightcounting predicted that the global market size of data communication optical transceivers would reach USD 22.8 billion by 2026, where the total market size of 800G and 1.6T optical transceivers would reach USD 14.6 billion in 2026, accounting for about 64% of the total market size of all data communication optical transceivers. Meanwhile, it’s predicted that the global market size of telecommunication optical transceivers would be USD 5.3 billion by 2026. Generally speaking, thanks to the rapid development of AI data centers, the data communication market, growing at an obviously faster rate than the conventional telecommunication market, has become the core driver for the growth of the optical transceiver industry. Lightcounting predicted that in the next three years, high-speed optical transceivers of 800G, 1.6T, etc. would dominate the market demands, while the quantity of 3.2T modules would increase gradually from 2028. It is quite probable that the annual sales volume of optical interconnects used in AI clusters would reach USD 100.0 billion by 2030.

As for the Company, Source Photonics’ core competitive advantages will be more and more prominent under the trend of rapid industry development. Source, as one of the few global enterprises having an integral layout of EML optical chips + optical transceivers, employs the IDM mode to maintain independence at core stages; it is one of the few enterprises with mass production capacities of 100G and 200G EML optical chips in China. Under the industry environment of supply shortage for high-end EML optical chips and high dependence on others, Source has prominent advantages in production capacity allocation and delivery response thanks to its capabilities above. Meanwhile, we are making active efforts to develop optical transceivers with two parallel technology routes, namely the silicon photonics solution and the independently developed EML to respond to the iteration of optical interconnect technologies with our diversified layout and building a technology basis for the next generation of high-speed product upgrade. In terms of production capacity expansion, Source is accelerating the pace of building EML optical chip and optical transceiver production capacities to effectively match with the pace of increasing quantity of downstream customers and the demand growth trend of the industry. In addition, our comprehensive advantages in key account services, supply chain management, delivery guarantee, customer qualifications, etc. can also effectively support the further customer development for Source.

1. Precision component industry

The precision component industry is an industry where precision processing, fast forming, automatic control, and other relevant technologies are employed to design, manufacture, process, assemble, and sell structural parts, functional modules, and complete devices with a complex structure and high precision. With the obvious characteristics of technology intensity, high precision requirements, high-efficiency production, high automation, strong non-standard customization capabilities, etc., this industry has strict requirements on product consistency, reliability, and lead time. In terms of the industry chain structure, the upstream industry chain of the precision component industry is the supply of raw materials and manufacturing equipment, mainly including raw materials like metal materials, and production equipment like cutting and forming equipment, processing equipment, test and inspection equipment, etc. The midstream of the industry chain is the precision processing and manufacturing stages, that

is, the processing of high-precision parts and functional modules and the assembly of complete devices by manufacturers. The downstream of the industry chain is the application field of precision component products, mainly including vehicles, telecommunication equipment, etc. Given the constant upgrade of the downstream manufacturing industry and the faster and faster emerging fields like AI, new energy vehicles, etc., the global application demands for precision component products are increasing, which creates a broad growth space for the development of the global precision component industry.

We have profound technology expertise and core competitiveness in the field of precision components and have built a mature and standard process system covering the stages of precision metal processing, module-based integration, precision assembly, etc., which can meet the strict requirements of vehicle customers for structural parts with high precision, high consistency, and high reliability. In terms of production capacity and layout, we have built a global supply network, including production bases located in Mexico, the United States, and Suzhou and Yancheng in China; moreover, we have successfully built production capacities in Europe and North Africa through the acquisition of GMD Group in France, which further improves our capabilities of local services in the field of global automotive components. All our customers of the precision component business are domestic and foreign leading automotive manufacturers; this outstanding customer structure not only provides stable orders for us, but also consistently promotes the introduction of new products and technology iteration. Generally speaking, we expect that our precision component business will achieve continuous and stable growth thanks to the growth period of the industry.

1. Photoelectric display industry

Photoelectric display products, as core devices for converting electrical signals into visual images, are core parts for electronic devices to present visual content and implement information and sensing interaction. Under the background of the extensive spread of consumer electronics, development of Internet communication technologies, and accelerated penetration of AI terminals, the demands for information interaction are continuously increasing, where photoelectric display products, as an important carrier, are widely used in fields like vehicles, consumer electronics, etc. Driven by the technological innovation, application, and extension and the increasing penetration of smart devices, the global photoelectric display industry has been developing stably, where the mainstream technology routes mainly include LCD and OLED.

Our photoelectric display products, with touch panels and LCMs at the core, are widely used in the fields of vehicles and consumer electronics. In the field of vehicles, the continuously increasing penetration of intelligent cockpits leads to the evolution towards vehicle-mounted displays featuring larger sizes, multiple displays, and high definition, and the vehicle-mounted display devices are upgrading from conventional information presentation carriers to the core medium for human-vehicle interaction to achieve human-vehicle interconnection. Relying on our technology accumulation and mass production capacity for touch panels and display modules, we can provide customers with integral display solutions and have been admitted to the supply chain of multiple leading vehicle manufacturers. In the field of consumer electronics, given the higher requirements of AI terminal devices on display interaction, touch panels and LCMs, as the core components for human-machine interface, are experiencing stably increasing demands. Thanks to our large-scale production capacities and stable delivery capabilities, we can promptly respond to the demands of downstream brand customers. In general, we expect continuous and stable growth of our photoelectric display business driven by the upgrade of vehicle-mounted displays and interaction innovation of consumer electronics.

II. Core Competencies of DSBJ

(I) Strategic advantage: AI end-to-end deployment to take early opportunities in a high-growth racetrack Our strategy focuses on an end-to-end AI deployment from the edge side to data centers. As an innovation-driven enterprise, we are dedicated to providing global top technology companies with advanced products and solutions by accurately taking the growth opportunities for global high-speed interconnection and data transfer. Relying on the clear strategic positioning, we have become the top 3 global PCB supplier, the top 2 global FPC supplier, and the top 10 global optical transceiver supplier, demonstrating our leading position in multiple fields and industries; meanwhile, we are the only enterprise having the whole-

process capabilities covering AI PCBs and optical transceivers (including optical chips) from R&D, designing, and mass production on the world, fully covering all scenario requirements from edge AI devices to large-scale data centers, which establishes our long-lasting competitive advantages. By providing AI PCBs and high-speed optical transceiver products for AI DC, we can help customers achieve data transfer with lower latency, higher transmission rate, and better energy efficiency; meanwhile, we engage in in-depth design cooperation with customers to shorten product development cycles and improve system performance of terminal products. In general, relying on the end-to-end whole-process capabilities in AI and our coordinated and integrated technology system, we can fully take the opportunities of business growth driven by AI for the future, and make use of the forward-looking layout of advanced processes and production capacities under the background of accelerated AI penetration on the edge side and data center to progressively improve market shares.

(II) Product advantage: Achieve horizontal synergy among multiple product categories and leading vertical integration, making optical transceivers and optical chips as the core highlights

By combining external acquisition with endogenous growth, we have built a comprehensive product system featuring full horizontal coverage and vertical integration, covering core businesses of electronic circuits, optical transceivers (including optical chips), precision components, photoelectric display modules, etc., which can provide whole-life cycle core device solutions for customers in the fields of cloud service providers, consumer electronics, intelligent vehicles, etc. to achieve closed-loop value growth. Based on the opportunities of industry development created by AI technologies, “optical transceivers (including optical chips) + AI PCB” have become our core product highlights and a critical factor in differential competition. Relying on Source Photonics, we are capable of whole-process independent development and mass production of EML optical chip IDM, making us one of the few domestic and even international players achieving mass production of high-end EML optical chips. With a full product matrix covering the rates of 2.5G to 200G, our main products are 100G/200G EML high-end series, with key product performance indicators and mass production capacities leading in the industry. In the field of optical transceivers, we have a layout covering the whole industry chain with products for all rates from 10G to 1.6T; moreover, we make continuous efforts to promote the R&D of next generation optical transceivers at 3.2T and above to build a new core growth driver for the Company. Meanwhile, we are making active efforts to develop optical transceivers with two parallel technology routes, namely the silicon photonics solution and the independently developed EML to respond to the iteration of optical interconnect technologies with our diversified layout and building a technology basis for the next generation of high-speed product upgrade. In the field of PCBs, we maintain our leading position in the industry as one of the top players and have professional manufacturing capabilities of ultra-HLC and high-density thick HDI PCBs. In the field of precision components, we have the capabilities of one-stop supply for core parts of vehicles, making us the only supplier in the industry that can concurrently supply multiple core parts for top vehicle manufacturers.

(III) Technology advantage: Drive innovation with leading product R&D capabilities in the industry We always put technological innovation at the core strategic position for corporate development. We deeply participate in preliminary development conducted by leading industry customers, accurately understand the trend of cutting-edge technologies, build an efficient coordinated R&D mechanism, and actively engage in industry-university-research cooperation with top universities, research institutions, and industry organizations to accelerate cutting-edge technology innovation and research results conversion to inject endless dynamics for high-quality development of the Company. With continuous efforts for R&D, acquisition, and integration, we have built unique technical advantages in electronic circuits, optical transceivers (including optical chips), precision components, and photoelectric display modules. In the field of high-end PCBs, we make great efforts in the R&D and manufacturing of circuit boards for AI servers and constantly iterate and upgrade high-density HDI and ultra-HLC high-speed board technologies to meet the high-density wiring requirements for the new generation of AI computing hardware, which lays a solid technology foundation for the Company in the field of high-end computing circuit boards. In the field of optical communication, operating in the industry for many years, Source Photonics has independently developed multiple key core technologies and built independent core technologies for EML optical chips under its control; meanwhile, with its independently

developed chip package and reliability verification system, it stays at the industry forefront in the R&D and commercial operation of ultra-high-speed optical transceivers. Relying on Source Photonics, we have built a whole-process technology system covering the manufacturing of EML optical chips to optical transceivers, which provides a core support for the Company to compete on the global optical communication market. At present, we are making active efforts for the R&D of optical transceivers at 3.2T and above, which can fully meet the requirements of AI data centers and other scenarios for ultra-large bandwidth interconnection and prepare for the next generation core technologies to provide solid technology guarantee for the iteration and upgrade of ultra-highspeed optical transceivers and help the Company maintain its leading position on the high-end racetrack of optical communication. Meanwhile, relying on our technology accumulation in electronic circuits, precision components, and photoelectric display modules, we will consistently consolidate our leading position in the industry to facilitate the high-quality development of the Company in all of our business segments.

• (IV) Scale advantage: Globally leading production capacity and outstanding ability for rapid production capacity expansion Based on years of operation and forward-looking strategic layout, we have built a globally leading and modern production capacity platform with prominent scale effects and comprehensive support systems, making us capable of large-scale manufacturing, whole-process quality management and control, and efficient and stable delivery, which is leading in the industry. Thanks to our mature production line replication system and capabilities for process standardization, we can increase our production capacity rapidly and expand production capacity flexibly during the window of explosive demands in the industry, allowing us to respond to additional demands of major downstream customers. Our new production capacity is planned in close alignment with the pace of industry technology iteration and the medium- to long-term development requirements of key downstream customers; by progressively improving the production capacity structure and improving the efficiency of resource allocation, we can constantly maximize operating benefits, consolidate our leading position in the industry, and build a solid foundation for long-lasting core competitiveness. In terms of core products, in the fields of electronic circuits and precision structural components, we have built prominent production capacity barriers on the basis of large-scale manufacturing advantages, fine management systems, and capabilities of rapid response, which puts us in a leading position in terms of product yield rate, delivery efficiency, and comprehensive cost control and facilities stable and reliable supply of core components for downstream customers. In the field of AI core hardware, we have built a comprehensive product matrix and production capacity expansion layout focusing on high added-value products, like optical transceivers (including optical chips), AI PCB, etc. At present, our production capacity expansion projects are progressing in order as planned, capacity ramping is under implementation smoothly, and the capability of large-scale supply is improving progressively to fully match with the increasing purchase demands of both domestic and overseas mainstream cloud service providers to provide a strong support for the construction of global computing infrastructure.
• (V) Customer advantage: Serving globally leading customers in various fields while continuously deepening in-depth cooperation

Relying on outstanding product quality, technology strength, and delivery capabilities, we have accumulated global outstanding customer resources and built a customer base consisting of top global consumer electronics brands, pure electric vehicle manufacturers, and cloud service providers, with businesses covering multiple high-growth industries like consumer electronics, vehicles, data centers, telecommunication equipment, etc., which can defend against the seasonal fluctuation and periodical risks of individual industries with the diversified industry layout. We establish long-term and in-depth strategic cooperation relationship with core customers, participate in product definition at the early stage of customers’ product development, closely follow the trends of technology routes, and accelerate product iteration through coordinated designing; after being admitted to customers’ supply chain, we make use of our rich product portfolio, technology expertise, and large-scale production capacity for extension to orders of associated products, thereby increasing sales to customers. For example, since the acquisition of MFLEX, we have been providing flexible PCB products for global leading consumer electronics manufacturers,

extending the application scope from smartphones to all consumer electronics product categories and new energy vehicles; in the vehicle field, we are providing integration solutions for global leading manufacturers to sustain and improve customer loyalty. Relying on the manufacturing capabilities of vertical integration of EML optical chips and optical transceivers, Source Photonics, a subsidiary of the Company, has become one of the core suppliers of global optical transceivers, which creates a bigger growth space for the Company in the field of AI computing hardware.

(VI) Globalization and operation advantage: Global layout of production capacities to empower intelligent manufacturing and build a resilient supply chain

We are deeply participating in the global supply chain system to build a global network for R&D, production, and sale in all aspects. In this aspect, we have established R&D teams in multiple countries and regions, including Chinese mainland, Taiwan Region, the United States, Singapore, France, etc., to attract local high-end professionals; meanwhile, we have production bases in 14 countries and regions covering Asia, North America, Europe, and Africa, which builds an efficient operation layout featuring “global R&D, local production, and integrated services” to rapidly respond to customer needs throughout the world and flexibly address the complex and volatile international trade environment. In the field of intelligent manufacturing, we have built an industry leading intelligent manufacturing system with AI empowering and data driver as the core, in which advanced technologies like machine visual AI detection and SMT automatic production line are widely used; moreover, we have built a production central control center to implement whole-process coordinated management and control. Many of our production bases won many honors, including the National Intelligent Manufacturing Demonstration Factory granted by the Ministry of Industry and Information Technology, and Jiangsu Provincial Industrial Internet Benchmark Factory, which significantly improves the scale of production capacities, product yield rates, and production efficiency, effectively reduces manufacturing costs, and ensures product quality consistency and stability. Relying on the global network of production capacities and preference for local procurement, we can implement local rapid delivery close to the end market, which reduces logistics costs, improves response speed, and enhances the anti-risk capabilities for the supply chain to provide a solid support for the continuous and stable development of global businesses.

(VII) Management and synergy advantage: Efficient management to empower whole-process synergy We have a management team with international understanding and forward-looking perspectives, which can make accurate strategic judgment and conduct efficient strategy implementation. Advocating the corporate spirit of “breakthrough, diversity, simplicity, journey”, we have built a scientific and efficient modern management system and made continuous efforts to build the digital and intelligent management system, construct a uniform operation and management platform to standardize procedures and accumulate experience in aspects of production and manufacturing, quality management and control, R&D projects, and supply chain scheduling and empower subsidiaries and business segments to improve operating efficiency. Having owned mature experience in cross-border acquisition and resource integration, we can rapidly promote cultural integration with the acquired target company, implement our management system, and achieve performance improvement. By completing multiple benchmark acquisition transactions in the industry, we have successfully entered a high-growth racetrack; we make continuous efforts to improve our product matrix and global layout of production capacities, build strict and regulated acquisition selecting and postinvestment integration systems to output our mature and successful experience in manufacturing management, digital operation, talent incentives to the acquired companies, and to efficiently achieve in-depth integration with acquired assets and release value by means of customer expansion, organizational structure optimization, supply chain synergy and integration, incentive mechanism improvement, etc.

In addition, we have achieved prominent synergy effects among various business segments: in terms of customer synergy, we achieved resource sharing and complementary cooperation in a diversified business matrix covering AI PCBs, optical transceivers (including optical chips), precision components, photoelectric display modules, etc., and deeply incorporated our products and businesses into the core supply chain of global leading cloud service providers and AI computing power customers, which effectively improves customer loyalty and overall shares; and in terms of supply chain synergy, we further optimized resource

allocation on the ground of our global layout of production capacities and centralized purchase system, which effectively enhances resilience of the supply chain against risks, reduces costs, improves efficiency, and builds solid competitive advantages in costs as a strong support for the long-lasting high-quality and sustainable development of the Company.

III. Analysis of Primary Business

In the first half of 2026, on the background of the accelerated global industry restructuring and a new development stage of the AI computing power industry chain, we made continuous efforts to deepen the top-level development idea with both “offensive and defensive characteristics”, and moved to in-depth industry operation and value creation on the basis of the business layout and acquisition achieved in 2025. We focused on quality and efficiency improvement for conventional businesses, and on release of new products, development of new customers, and expansion of new production capacities for emerging businesses. With continuous iteration for global coordination, technological innovation, organization governance, and financial risk control system, we are moving from layout implementation to result realization for various strategies. During the reporting period, we achieved stable and improving operation as a whole, and further enhanced organic drivers for high-quality development. In the first half of 2026, we achieved the operating revenue of RMB 27.798 billion, a year-on-year increase by 63.95%, and the net profit of RMB 2.957 billion, a year-on-year increase by 290.09%. The overall operation during the reporting period is summarized as follows:

(I) Improved quality and efficiency for conventional businesses and built a resilient operating system with balanced new and old businesses

During the reporting period, we moved from scale expansion to the improvement of profit quality and counter-cyclical capabilities for our basic businesses, including core devices for consumer electronics and core parts for vehicles. Relying on mature product lines for electronic circuits, precision structural components, photoelectric display modules, etc., we made use of our global manufacturing network and outstanding customer resources to improve our product and customer structures constantly in an effort to respond to the periodical fluctuation pressure from the downstream industry, maintain stable profitability, and achieve stable operating cash flows. Our conventional businesses provided a continuous resource basis for the technology R&D, production capacity investment, and global expansion of emerging racetracks, while the growth of emerging businesses leads to future revenues and profits for the company, which makes a virtuous cycle supporting each other. By maintaining the existing core business and expanding future growth drivers, we can effectively protect against cross-industry and cross-cycle fluctuations and promote our strategic transformation from scale-driven growth to quality-and-efficiency-first improvement, to further enhance our overall operating resilience and risk resistance.

(II) Took the opportunities of the AI computing power industry to move from capacity building to value release for “optical transceivers (including optical chips) + AI PCBs”

The reporting period witnessed the shift from scale expansion to product iteration and capability improvement in the global AI computing power building, while downstream customers raised higher requirements in product performance, stable delivery, comprehensive supporting capabilities, etc. for core devices. Relying on the industry layout completed in 2025, we made great efforts to make use of our unique industry synergy to build one-stop product solution capabilities covering optical transceivers (including optical chips) + AI PCBs. In the field of optical communication, Source Photonics, after completing preliminary production capacity building, focused on deepening product technology iteration, supply chain improvement, and customer development. It accumulated technologies and achieved breakthroughs around the next generation of high-speed products, made continuous efforts to integrate internal R&D, manufacturing, marketing to accelerate customer qualification and batch delivery of high-end products, progressively developed global mainstream customers, and improved market position and added value for products. For the AI PCB business, based on the technologies of Multek, we made active efforts for AI server iteration to match

with product upgrade. Having formed a synergistic resonance in technology, customers, and supply chain, the two business segments facilitate the continuous consolidation of our differentiated competitive advantages in the field of core devices for AI data centers.

(III) Deepened the competence of global operation to move from construction of production capacities to local-based value creation in overseas layout

Following the acquisition of GMD Group in France in 2025, we shifted from acquisition closing to deep integration and value realization in our globalization efforts. We fully released the synergistic potential of the GMD Group to leverage its established manufacturing bases and complete vehicle customer resources in Europe and North Africa, which further deepened our regional layout and enhanced our overseas production capacity and customer matrix in the vehicle business. We always optimized our global manufacturing network covering Asia, the Americas, Europe, and Africa, and moved from mere capacity coverage to actively promoting global resource allocation, technology sharing, and experience exchange to enhance cross-regional collaborative operations. We made continuous efforts to build international talent pipeline and empower overseas teams to extend their roles from execution to market development and technology iteration. Thanks to our local layout that is close to customers, we can accurately capture the differential demands of customers from various regions, respond rapidly and make delivery efficiently, thereby transforming our global hardware layout to core soft capacities for market development and risk diversification and expanding the growth boundaries for the long-lasting development of the Company.

(IV) Strengthened technological innovation to upgrade product competitiveness by means of both technology and manufacturing

Insisting on development driven by innovation, we further improved the innovation system for the AI hardware racetrack on the basis of our forward-looking layout. We focused on key fields, including high-speed EML optical chips, high-speed optical transceivers, and AI PCBs, balanced preliminary research of cutting-edge technologies and mass production technologies to build a technology base in advance with customer demands for the next generation of products in mind, and progressively iterated and optimized our product matrix to build product advantages toward the future. To empower innovation results with intelligent manufacturing, we made continuous efforts for in-depth integration of intelligentization and informatization. We established data links among global bases relying on the Internet platform, empowered the whole production process with data, and progressively optimized the production scheduling system, process level, and yield rate performance to efficiently adapt to global customers’ orders requiring customization, various specifications, and short lead time. We insisted on promoting the engineer culture to fully motivate the innovation potential of R&D and technology talents, and building a channel for industry-university-research cooperation to create long-lasting competition barriers with hard technologies.

(V) Improved governance competence to build organic drivers in the organization and talents to match with diversified crossborder businesses

On the background of our continuous business expansion and the successive integration of acquired entities, our organization building is moving from architecture building to governance competence upgrade. Focusing on the overall strategy, we deepened the management mechanism featuring “coordination and empowering by the group, and professional operation by business units” to break business segment and regional barriers and promote efficient coordination among R&D, supply chain, and sales resources, aiming to improve our integrated capabilities for providing comprehensive services to customers in all aspects. In terms of talent building, we attracted suitable high-profile talents for key fields, like optical communication, global operation, etc., improved the internal channel for talent development, strengthened efforts for professional competence building, and built a talent team with both professional expertise and international perspectives. We optimized the appraisal and incentive mechanism to promote

simultaneous advancement of personal value and corporate development. We promoted intercultural integration under the corporate culture of “openness, inclusion, pragmatism and enterprising”. Meanwhile, we made iteration for the internal control, compliance, and risk control systems to adapt to complex scenarios of cross-border operation in multiple business segments. Lifting the integration of acquired targets to the core level of corporate governance, we promoted the in-depth integration of Source Photonics and GMD Group in France in aspects of businesses, organization, regulations, and culture to truly transform acquisition advantages into the Company’s core competence and to shift “assets from acquisition” to “value creation driven by acquisition”, hence supporting the Company’s stable and long-lasting organization efforts.

(VI) Upheld active and prudent financial strategies to achieve dynamic balance between strategic investments and safeguarding against risks

In response to the capital expenditure demands from industry upgrade and the complex external market environment, we adhered to the active and prudent financial strategy to further strengthen the financial management model with balanced strategic orientation and risk bottom lines. We planned resource allocation scientifically, with capital resources prioritized to support strategic production building in key areas like optical communication and AI PCBs, managed capital expenditure paces in a reasonable manner, and actively met the funding needs of globalization and industry upgrade through diversified financing instruments while making continued optimization of our capital and debt structure. We insisted on the idea of “cash priority”, taking the quality of operating cash flows as a key factor in operation to improve liquidity management and comprehensive budget and final account system, firmly holding the safety bottom line for funds. We always optimized hedging mechanisms against fluctuations in exchange rates and commodity prices, and implemented detailed and practical whole-process financial risk management controls. We deepened the integration of business and finance, promoted the embedding of financial management into the entire business chain and empowered cost reduction, efficiency improvement, and profitability structure optimization from a financial perspective. We made continuous efforts to iterate our global financial management and control system, strengthen the financial management capabilities of overseas subsidiaries, and ensure that all acquired entities can be smoothly and efficiently integrated into our financial system. The systematic financial governance and the balance between expansion and risk prevention help to build a solid and reliable financial foundation to support the sustained execution of our strategies.

Year-on-year changes in key financial data

In RMB

Whether there is a significant change in the components or sources of profits during the reporting period of the Company?

□ Applicable  N/A There have been no significant changes in the components or sources of profits during the reporting period of the Company. Components of operating revenue

In RMB

Segments, products, or regions representing more than 10% of operating revenue or profit of the Company  Applicable □ N/A

In RMB

In case of any adjustment to the statistic scale for primary business data, the primary business data of the most recent reporting period as adjusted according to the statistic scale applied at the end of the reporting period

□ Applicable  N/A

IV. Analysis of Non-primary Business

□ Applicable  N/A

V. Analysis of Assets and Liabilities

1. Material changes in the components of assets

In RMB

2. Main overseas assets

 Applicable □ N/A

In RMB

3. Assets and liabilities measured at fair value

 Applicable □ N/A

In RMB

4. Encumbrances on assets as of the end of the reporting period

In RMB

VI. Analysis of Investments

1. Overview

 Applicable □ N/A

2. Major equity investments acquired during the reporting period

□ Applicable  N/A

3. Major non-equity investments that have not yet been completed in the current period

□ Applicable  N/A

Suzhou Dongshan Precision Manufacturing Co., Ltd. Semi-Annual Report 2026

4. Investment in financial assets

(1) Investment in securities

 Applicable □ N/A

In RMB

33

(2) Investment in derivatives

 Applicable □ N/A

1) Investment in derivatives for hedging purposes during the reporting period

 Applicable □ N/A

In RMB 0’000

2) Investment in derivatives for speculative purposes during the reporting period

• □ Applicable  N/A The Company did not have any derivative investment for speculative purposes during the reporting period.

• 5. Use of offering proceeds

• □ Applicable  N/A There was no use of offering proceeds by the Company during the reporting period.

VII. Sale of Material Assets and Equities

• 1. Sale of material assets

□ Applicable  N/A No material asset has been sold during the reporting period.

• 2. Sale of material equities

□ Applicable  N/A

VIII. Analysis of Major Subsidiaries and Associates

 Applicable □ N/A Major subsidiaries and associates representing more than 10% of the net profit of the Company

In RMB

Subsidiaries acquired or disposed of during the reporting period

□ Applicable  N/A

IX. Structured Entities Controlled by the Company

□ Applicable  N/A

X. Risk Exposures to the Company and Countermeasures

• 1. Risk of concentration of customers We have good customer resources. Our major customers are well-known domestic and international companies in the relevant industries that are of sound credit and have established stable cooperation relationships with us. However, our top 5 customers constitute a large proportion of our total sales revenue, which may further increase in the future. Any material adverse change in the business situation of such major customers could have an adverse effect on our business. We will pay close attention to the industry development dynamics of key customers and customer credit and take active measures for new product and new customer development to reduce the adverse effects of high concentration of customers on the Company.
• 2. Risks brought by rapid technology upgrading of the industry Our business covers electronic circuits, optical transceivers (including optical chips), precision components, photoelectric display modules, and other technology-intensive industries, and our products are widely applied in AI data centers, consumer electronics, vehicles, communication equipment, and other fields, all of which are characterized by rapid technology upgrading. If our R&D and manufacturing capabilities fail to keep pace with the rapid technology upgrading of downstream products, our products and technologies may become obsolete. We will closely follow the trend of cutting-edge technologies in relevant industries and maintain in-depth communication with key customers to ensure advanced technologies for our products. Meanwhile, we will keep close cooperation with influential universities and research institutions in the industry to maintain our advantages in technologies and processes.
• 3. Risk of changes in the global trade environment Our major customers include some well-known international companies, and our export sales have grown steadily for years. Though China has established good economic and trade cooperation relationships with major countries in the world, the increasingly fierce regional frictions in recent years may cause uncertainties in the applicable trade policies, which could affect our international trade. Facing the complex and volatile international trade conditions, we will pay close attention to changes in geopolitical trade policies, progressively optimize the global industry layout, consolidate capabilities for local operation and support, deepen normal communication with customers, strengthen study on relevant international trade rules and compliance management, and take systematic measures to protect against operating risks from changes in the external environment.
• 4. Risk of market exploitation Our business covers the R&D, production, and sale of electronic circuits, optical transceivers (including optical chips), precision components, and photoelectric display modules; our products are widely applied in consumer electronics, vehicles, data centers, AI computing infrastructure, and other fields; and our customers are mostly leading enterprises in the industry. Our industry has the characteristics of fast technology iteration, short product life cycle, and intense market competition. If we cannot closely follow the technology development trend of the industry, cannot make sufficient investment in R&D, cannot promptly meet the constantly improving product and technical requirements of existing core customers and downstream industries, or under the impact of strict qualifications of downstream industry suppliers and long verification period, we cannot promptly develop highquality core customers and smoothly enter their supply chain system, we may experience insufficient orders and decreasing market shares, resulting in adverse effects on the sale of our products, operating revenue, profitability, and operating performance. We will increase investment in R&D and strengthen technological innovation and product iteration for continuous improvement of our core competitiveness. We will take active measures to build a reserve mechanism of multiple customers, optimize our customer

structure, and build a diversified customer base. We will take early measures intended for the qualification system of target customers, and build a dedicated working team to effectively promote qualification evaluation and admission procedures. Meanwhile, we will make continuous efforts to enhance whole-process quality management and control and guarantee production capacity, and improve the comprehensive delivery capabilities in all aspects to provide a solid support for the Company to promote stable market expansion and achieve sustainable operation.

• 5. Environmental risk The production process of our products involves critical steps like epitaxial growth, etching, passivation, photolithography, development, cleaning, and electroplating, which generates wastewater, exhaust gases, solid waste, and various toxic and hazardous substances. Therefore, we are subject to high management and control requirements for environmental protection. Despite our correspondingly established management measures for environmental protection, they cannot fully eliminate the risks of environment accidents caused by management defects, equipment failures, force majeure, or other factors. In the event of a pollution accident or violation of relevant environmental protection laws and regulations, we may face punishment, be required to make rectification, and suffer reputation damages, which may cause adverse effects on our production and operation. In addition, given the continuous implementation of green and low-carbon development throughout China and stricter supervision over environmental protection, if the environmental protection standard is further enhanced in the future, we need to continuously increase investment in environmental protection and strengthen transformation, which may correspondingly increase the operating costs of environmental protection and affect our operating performance. We have set “building of an environment-friendly enterprise” as a key goal of our sustainable development strategy, actively implemented the requirements of relevant latest environmental protection laws and regulations, improved the environmental management system, enhanced training and employees’ awareness, taken control measures at source, and implemented the requirements related to environmental safety in all of our key business activities, to reduce the environmental risks.
• 6. Foreign exchange risk Export sales constitute a large proportion of our total sales revenue. Because our day-to-day operation involves transactions in USD and other foreign currencies, and our consolidated accounts are presented in RMB, the changes in the exchange rate between RMB and USD may cause foreign exchange risk to our future operations. We will keep a close watch on the changes in the relevant foreign exchange rates, strive to control the exposure to foreign exchange risk at a reasonable level, and hedge or otherwise reduce exposure to such risk.

XI. Formulation and Implementation of Market Value Management System and Valuation Improvement Plan

Whether the Company has formulated a market value management system?  Yes □ No Whether the Company has disclosed a valuation improvement plan?

□ Yes  No

For details, refer to the Market Value Management System disclosed on www.cninfo.com.cn.

XII. Implementation of the Action Plan to Improve the Quality and Returns

Whether the Company has disclosed its action plan announcement to improve the quality and returns?

□ Yes  No

Section IV Corporate Governance, Environment, and Society

I. Changes in Directors and Senior Executives

 Applicable □ N/A

II. Particulars of Profit Distribution and Transfer of Capital Reserve to the Share Capital for the Reporting Period

□ Applicable  N/A The Company has no plan to pay cash dividends, distribute bonus shares or convert any capital reserve to the share capital for the first half of this year.

III. Share Incentive Plans, Employee Stock Ownership Plans or Other Employee Incentives

 Applicable □ N/A

• 1. Share incentives: None
• 2. Employee stock ownership plans (ESOPs)

 Applicable □ N/A Effective ESOPs in the current period

Changes in asset manager during the reporting period:

• □ Applicable  N/A Changes in equity due to disposal of shares by the holders or otherwise during the reporting period:
• □ Applicable  N/A

• Exercise of shareholder rights during the reporting period: N/A Other information related to the ESOPs during the reporting period and the relevant explanation
• □ Applicable  N/A Changes in the members of the ESOP management committee during the reporting period
• □ Applicable  N/A The financial effect of the ESOPs on the Listed Company during the reporting period and the relevant accounting treatment
• □ Applicable  N/A Termination of the ESOPs during the reporting period:
• □ Applicable  N/A

3. Other employee incentive measures

□ Applicable  N/A

IV. Disclosure of Environmental Information

Whether the Listed Company and its major subsidiaries are included in the list of enterprises to disclose environmental information in accordance with law  Yes □ No

V. Social Responsibility

Upholding the idea of “integration of enterprise development with social responsibility”, and under the mission of “building a better connected world for tomorrow”, we have progressively improved the governance system to include the concerns of stakeholders, the creation of social value, and the environment sustainable development into our core decision-making in an effort to seriously fulfill the responsibilities as a corporate citizen and promote the economic and social high-quality development.

In the first half of 2026, we made continuous efforts to deepen ESG management practices while insisting on “customercentric” and incorporating customers’ requirements and high quality standards into the full life cycle of products to ensure rapid response and efficient handling of requests and sustained supply of high-quality products and satisfactory services. On the basis of our business strategy, we strove to create a fair and transparent purchase environment, optimize the whole-life cycle supplier

management, and made continuous efforts to build a competitive, resilient, and sustainable supply chain system. We strictly abided by laws, regulations, and policies by establishing and improving the labor and human rights management system, progressively improving the talent training and development system, and constantly improving the sense of belonging and value of employees. We made active efforts to develop the regional economy and continuous efforts for public welfare and charity activities, in order to fulfill our corporate social responsibility and promote social development with our practical acts.

Section V Significant Matters

I. Covenants made by the actual controllers, shareholders, affiliates and acquirer of the Company, the Company itself and other related parties that have been fulfilled during the reporting period or that fail to be fulfilled on time as of the end of the reporting period

 Applicable □ N/A

II. Occupation by the Controlling Shareholders and their Affiliates of the Funds of the Listed Company for Non-operating Purpose

□ Applicable  N/A Our controlling shareholders and their affiliates have not occupied our funds for non-operating purposes during the reporting period.

III. External Guarantees in Violation of the Regulations

□ Applicable  N/A We have not provided any external guarantee in violation of the applicable regulations during the reporting period.

IV. Engagement and Termination of Engagement of Accounting Firm

Has the semi-annual financial report been audited?

□ Yes  No The semi-annual report has not been audited.

V. Explanation by the Board of Directors about the Modified Auditor’s Report Issued by the Accounting Firm for the Reporting Period

□ Applicable  N/A

VI. Explanation by the Board of Directors about the Modified Auditor’s Report of the Previous Year

□ Applicable  N/A

VII. Matters Relating to Bankruptcy and Reorganization

□ Applicable  N/A We have not been involved in any bankruptcy or reorganization proceedings during the reporting period.

VIII. Litigation

Material litigation and arbitration proceedings

• □ Applicable  N/A We have not been involved in any material litigation or arbitration proceedings during the reporting period. Other litigation proceedings
• □ Applicable  N/A

IX. Punishments and Rectifications

□ Applicable  N/A We have not been involved in any punishment and rectification during the reporting period.

X. Credit Standing of the Company and its Controlling Shareholders and Actual Controllers

□ Applicable  N/A

XI. Material Related-party Transactions

1. Related-party transactions relating to day-to-day operation

□ Applicable  N/A There has been no related-party transaction relating to day-to-day operation during the reporting period.

2. Related-party transactions involving the acquisition or sale of assets or equities

□ Applicable  N/A There has been no related-party transaction involving the acquisition or sale of assets or equities during the reporting period.

3. Related-party transactions involving joint external investment

□ Applicable  N/A There has been no related-party transaction involving joint external investment during the reporting period.

4. Debts owed by and to related parties

□ Applicable  N/A There has been no debt owed by or to related parties during the reporting period.

5. Dealings with affiliated financial companies

□ Applicable  N/A There has been no deposit, loan, facility or other financial businesses between us and any of our affiliated financial companies.

6. Dealings between financial companies controlled by the Company and its affiliates

□ Applicable  N/A There has been no deposit, loan, facility or other financial businesses between any of our controlled financial companies and affiliates.

7. Other material related-party transactions

□ Applicable  N/A There has been no other material related-party transaction during the reporting period.

XII. Particulars and Performance of Material Contracts

1. Trusteeship, contracting and leases

(1) Trusteeship

□ Applicable  N/A No such case during the reporting period.

(2) Contracting

□ Applicable  N/A No such case during the reporting period.

(3) Leases

□ Applicable  N/A No such case during the reporting period.

2. Material guarantees

 Applicable □ N/A

In RMB 0’000

3. Entrusted wealth management

 Applicable □ N/A

In RMB 0’000

4. Other material contracts

• □ Applicable  N/A

• XIII. Record Forms for Investigation, Research, Communication, Interview and Other Activities during the Reporting Period

 Applicable □ N/A

• XIV. Other Significant Matters

□ Applicable  N/A There’s no other significant matter needing to be explained for the reporting period.

• XV. Significant Matters of Subsidiaries

• □ Applicable  N/A

Section VI Changes in Shares and Shareholders

I. Changes in Shares

1. Changes in shares

In Shares

Cause of change

• □ Applicable  N/A Approval of changes in shares
• □ Applicable  N/A Registration of changes in shares
• □ Applicable  N/A

• Progress of share repurchases
• □ Applicable  N/A Progress of sale or repurchase of shares by call auction
• □ Applicable  N/A

Effect of changes in shares on financial indicators including the basic earnings per share, diluted earnings per share, net assets per share attributable to ordinary shareholders of the Company, etc. in the last year and the last period

• □ Applicable  N/A Other information that should be disclosed at the discretion of the Company or at the request of the securities regulatory authorities
• □ Applicable  N/A

2. Changes in non-tradable shares

□ Applicable  N/A

II. Offering and Listing of Securities

□ Applicable  N/A

III. Number of Shareholders and Shareholding Structure of the Company

In Shares

IV. Changes in Shareholding of Directors and Senior Executives

□ Applicable  N/A There has been no change in the shareholding of our directors and senior executives during the reporting period, as detailed in the Annual Report 2025.

V. Changes in Controlling Shareholders and Actual Controllers

Describe the progress of change of control if the Company has previously disclosed a planned change of control by the actual controllers but not completed

• □ Applicable  N/A Change in the controlling shareholders during the reporting period
• □ Applicable  N/A There has been no change in our controlling shareholders during the reporting period. Change in the actual controllers during the reporting period
• □ Applicable  N/A There has been no change in our actual controllers during the reporting period. VI. Preferred Shares
• □ Applicable  N/A We did not have any preferred share during the reporting period.

• Section VII Bonds
• □ Applicable  N/A

Section VIII Financial Report

I. Auditor’s Report

Has the semi-annual report been audited?

□ Yes  No This semi-annual financial report has not been audited.

II. Financial Statements

The amounts in the statements contained in the notes to the financial statements are presented in RMB

1. Consolidated balance sheet

Prepared by: Suzhou Dongshan Precision Manufacturing Co., Ltd. June 30, 2026

In RMB

Legal Representative: YUAN Yonggang CFO: WANG Xu Accounting Supervisor: ZHU Deguang

2. Standalone balance sheet

In RMB

3. Consolidated income statement

In RMB

Legal Representative: YUAN Yonggang CFO: WANG Xu Accounting Supervisor: ZHU Deguang

4. Standalone income statement

In RMB

5. Consolidated cash flow statement

In RMB

6. Standalone cash flow statement

In RMB

7. Consolidated statement of changes in owners’ equity

Amount of the current period

In RMB